• Semiconductor Laser Processing Machine
  • UV Laser Processing Machine Dual-Axis with EFEM
  • We provide the most reliable products
  • Our laser has high beam quality (M² < 1.2) and the minimum processing Beam is φ10um. In addition to drilling, it can also perform shape cutting, cavity and other processing.

Various material processing applications


1.PCB, FLEXPCB.
 

2.High molecular weight polymer, ABF resin, ABS resin
 

3.Ceramic, LTCC.
 

4.Silicon wafers, steel plates.